The ASM MS90 is a fully automated wafer-map-based die sorting system, primarily designed for the classification and picking of semiconductor dies. It features a dual-head pick-and-place arm driven by linear motors, supports dies ranging from 0.15 mm to 5 mm square, offers a standard XY positioning accuracy of ±38 µm, and can process wafers up to 8 inches in diameter.
The EPM (Electronic Pick Module), in conjunction with linear motors and direct-drive motors, enables precise XY positioning.
