Semiconductor Product

Besi Z-DRIVE PPBAZ P/N: 5000-0210

It is the core drive component within the bonding head of a Besi die bonder, responsible for precise vertical positioning and force control.

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Besi Wafer Ring Unit P/N:102269361

The wafer ring device of the Besi die bonder is the core execution component of the wafer supply system

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ASM MS90 EPM Module 02-E11084-09/A

The ASM MS90 is a fully automatic wafer-map-based die sorting system.

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asm ms100 plus ii

The ASM MS100 PLUS II is a map sorter primarily used in semiconductor back-end processing

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