The DISCO DAD3220 is a discontinued single-spindle automatic dicing saw. Within DISCO’s product lineup, its core purpose is clear: to provide an intuitive, fully-featured, high-volume production dicing solution for 6-inch wafers, all housed within an exceptionally compact footprint.
Its most notable feature is space efficiency. With a chassis width of only 500 mm, it occupies approximately 14% less floor space than its predecessor, the DAD321—a significant advantage for production lines with limited cleanroom space that require high-density equipment layouts. In terms of processing capacity, it supports standard 6-inch (Φ6") wafers, and can also accommodate 150 mm × 150 mm square workpieces through custom specifications.
Regarding efficiency and ease of use, the DAD3220 comes standard with a touchscreen LCD and a graphical user interface. It includes automated features—such as auto-calibration, auto-focus, and automatic kerf detection—which lower the operational barrier and reduce the need for manual intervention. The newly developed 1.5 kW spindle (with a rotational speed range of 3,000–40,000 min⁻¹) features a spindle-locking mechanism to facilitate blade changes, while an optional low-expansion spindle is available to minimize displacement caused by temperature fluctuations. In terms of precision, the Y-axis positioning accuracy is 0.005 mm/160 mm (with a single-point error of 0.003 mm/5 mm), and the Z-axis repeatability is 0.001 mm.
Optional features are also designed with practical application in mind: coolant flow rates can be set individually based on specific processing parameters, preventing operational errors and ensuring consistent flow; a wide-field microscope simplifies calibration; and the internal chassis includes dedicated space for a transformer or an uninterruptible power supply (UPS). As a discontinued model, the DAD3220 served as a vital link in the evolution of compact dicing saws, with its design philosophy continuing to influence subsequent generations of equipment.
