The DISCO DAD3651 is an ultra-compact, fully automatic dicing saw featuring an opposed dual-spindle configuration. Designed to strike an optimal balance between a small footprint and high throughput, it is primarily intended for dicing Φ200mm (8-inch) wafers and precision electronic components.
Core Positioning: Maximizing Throughput within a Compact Footprint
The DAD3651 occupies only two-thirds of the floor space of the popular single-spindle DAD3350 model, yet it achieves up to double the production efficiency through simultaneous dual-spindle dicing. This "compact, dual-spindle" design offers a distinct productivity advantage for production lines with limited space.
Key Specifications and Process Capabilities
Equipped with 1.8 kW spindles capable of speeds ranging from 6,000 to 60,000 min⁻¹, the machine utilizes a high-rigidity, short-spindle design that enhances processing stability. It delivers a Y-axis positioning accuracy of 0.002mm/260mm and a Z-axis repeatability of 0.001mm, ensuring consistent dicing results. While it supports standard Φ8-inch (250mm × 250mm) workpieces, it can also be configured to accommodate larger Φ300mm or 250mm square workpieces. Furthermore, by installing different blades on each spindle, the system can perform step-cutting, meeting the requirements for higher-quality processing.
User-Friendly Design
The machine features a large 19-inch LCD touchscreen. Essential operations—such as machine control, workpiece loading/unloading, and blade replacement—are all centralized on the front of the unit. Additionally, the inclusion of an automatic calibration function helps reduce the operator's workload and improves efficiency during production line changeovers.
Typical Applications
This model is widely used in the manufacturing of precision passive components and filters. It is particularly well-suited for applications—such as ceramic capacitors and SAW filters—that demand both high dicing precision and high production throughput.
