The DISCO DAD3650 is a discontinued, ultra-compact, fully automatic dicing saw featuring dual opposing spindles, designed for the high-efficiency processing of Φ200mm (8-inch) wafers and 250mm square substrates.
Core Positioning: Doubling Throughput in a Compact Footprint
The fundamental design philosophy of the DAD3650 is to achieve a significant boost in throughput within a limited space. With a footprint only two-thirds that of the then-popular single-spindle DAD3350 model, it utilizes dual spindles for simultaneous cutting—effectively doubling production capacity compared to single-spindle units—making it an ideal choice for production lines that prioritize high output per unit of floor area.
Key Specifications and Process Capabilities
The system is equipped with 1.8kW spindles capable of operating at speeds ranging from 6,000 to 60,000 min⁻¹. It offers a Y-axis positioning accuracy of 0.002mm/260mm and a Z-axis repeatability of 0.001mm, ensuring stable cutting performance. It supports a wide range of materials—including silicon, glass, quartz, sapphire, silicon carbide, and ceramics—with a processing thickness range of 100–2500μm. By installing different blades on each spindle, the machine can also perform step-cutting, meeting the requirements for high-precision, high-quality processing applications.
Ease of Use and Eco-friendly Design
The DAD3650 utilizes the same graphical user interface (GUI) as the DAD3350, featuring a 19-inch LCD touchscreen and standard automatic calibration functions, which help reduce the operator's workload. The low-heat-generation spindle design also reduces cooling water consumption by half compared to previous models. This model is now discontinued; only spare parts support remains available.
