The DISCO DAD3660 is a semi-automatic, dual-spindle dicing saw designed for processing large-format packaging substrates, offering an optimal balance between throughput, large-workpiece compatibility, and process stability.
Core Positioning: Overcoming Throughput Bottlenecks for Large Substrates via Dual Spindles
The DAD3660 supports standard Φ300mm wafers and can be configured with specialized dicing frames or fixtures to accommodate square workpieces up to 360mm × 360mm, directly addressing the dicing requirements for large-format packaging substrates such as Fan-out WLP. Its primary efficiency advantage stems from "Dual Cut" capability—simultaneous dicing using two spindles—which can boost throughput by up to 90% compared to the single-spindle DAD3350 (a model specialized for Φ300mm wafers).
Process and Operational Highlights
Heavy-Duty Processing: Optional 2.2kW high-torque, high-rigidity spindles are available to handle demanding applications, such as dicing hard, brittle materials (e.g., glass or ceramics) or performing grooving operations with thick blades.
Design for Stable Quality: A sub-chuck table enables in-process blade dressing (supporting dressing boards up to 75×75mm), which helps prevent blade loading and ensures consistent dicing quality for materials like glass, resins, and metals. Additionally, a length-measurement alignment function provides multi-point calibration, ensuring high precision even when processing materials prone to expansion or contraction, such as resin-based substrates.
Production Flexibility: The system allows multiple packaging substrates to be mounted on a single dicing frame for simultaneous processing, which reduces material changeover time and lowers the consumption of dicing tape.
Ease of Use and Space Efficiency: The unit features a 19-inch large-screen display, along with automatic alignment and dicing-kerf inspection capabilities. Auxiliary equipment—such as power-failure backup systems, transformers, and CO₂ injection units—has been integrated into the main chassis, effectively reducing the machine's footprint on the production floor.
