The SRM XD-244 is a semiconductor test handler designed for small-to-medium-sized packages. It is engineered for final testing, specifically facilitating an automated "tube-to-tape-and-reel" process that delivers high throughput within a compact footprint.
Core Specifications and Throughput
The system supports a wide range of package types, including TSSOP (14–38 pins), SOIC, MSOP, D-PAK, TO220, and QFN/MLP. With a nominal throughput of up to 28,000 units per hour (UPH), it ranks among the higher-performing handlers for tube-fed input. It features a stackable tube loader at the input side and a tape-and-reel output system, allowing for direct taping after testing and eliminating the need for intermediate handling steps.
Testing and Vision Capabilities
The XD-244 is equipped with four test stations, supporting parallel testing to maximize output efficiency. Optional vision inspection modules are available, including features for mark and orientation verification, PVI (pin/bottom pad inspection), 3D pin or bottom pad inspection, 5S inspection, and in-pocket mark/orientation checks. These options are designed to detect visual defects and orientation errors before or after testing, thereby minimizing the escape of defective parts.
For production lines handling small-to-medium-sized packages—where components arrive in tubes and require direct taping for shipment following final testing—the XD-244 offers a robust solution with high throughput and ample test station capacity.
