The LV-NEO series by UENO SEIKI is a line of equipment designed for the sorting and visual inspection of power semiconductor bare dies, accommodating die sizes ranging from 1 mm to 10 mm. Rather than a single-function test handler, it serves as a flexible platform available in three distinct configurations, primarily tasked with the handling, visual screening, and categorized sorting/storage of power semiconductor bare dies during the back-end manufacturing process.
Three Configuration Options
The series offers three input-to-output combinations: Wafer-to-Tray (with a throughput of up to 18,000 UPH, supporting 6/8/12-inch FFC wafer frames), Tray-to-Tray (supporting sorting into up to 5 categories), and Tray-to-Tape (supporting carrier tape widths of 8, 12, 16, and 24 mm). This versatile design allows the system to adapt to the specific input and output requirements of various production lines.
Core Capabilities
Visual inspection comes standard on the LV-NEO, covering the detection of cracks, plating defects, and probe marks; optional features include color cameras and infrared (IR) inspection. The handling system utilizes a load-controlled process for bare dies, which is crucial for maintaining the integrity of power semiconductor dies—particularly those that are thin or made from brittle materials.
Positioning
The LV-NEO is specifically targeted at power semiconductor bare dies (1–10 mm in size) that require visual screening and sorting into trays or carrier tapes. For production lines handling packaged components (such as QFN or SOT), UENO’s XD or RV series are the appropriate choices; for applications using bulk feeders where ultra-high speed is the priority, the LT-NEO is the suitable model. The LV-NEO fills a specific niche: the visual sorting and tray management of power semiconductor bare dies prior to the packaging process.
