This is a wafer mapping sorting machine. Hardware and features include:
Dual-head independent configuration: Equipped with two independent placement heads, supporting single-needle or dual-needle allocation configurations to enhance parallel processing capabilities.
Integrated vision inspection: Built-in vision system for placement quality inspection, performing dual alignment accuracy checks before placement.
Material adaptability: Adjustable cutting height and length, handling various materials from thin films to thicker substrates.
Low-pressure alarm protection: Immediately stops operation upon detecting an anomaly to prevent product damage due to pressure issues.
