The DISCO DAD323 is a single-spindle automatic dicing saw—a model discontinued many years ago—designed to handle a diverse range of materials, from semiconductor wafers to electronic components, within an exceptionally small footprint. At the time of its release, DISCO marketed it as the world’s most compact dicing saw, featuring a chassis width of only 490 mm. This space-saving design is highly practical for production lines that require multiple units to be arranged side-by-side in a cleanroom environment to maximize throughput per unit of floor area.
In terms of performance, the DAD323 comes standard with a 2.0 kW high-torque spindle (40,000 min⁻¹) offering a rated torque of 0.48 N·m, and it supports square workpieces up to 6 inches in size. An optional Y-axis linear scale can be added to achieve higher-precision stepping control, enabling the processing of challenging materials such as glass and ceramics. Additionally, a 1.8 kW high-speed spindle (reaching up to 60,000 min⁻¹) is available as an option to further expand process versatility. Regarding efficiency, the integration of a high-performance MCU has significantly increased the return speeds of the X, Y, and Z axes compared to its predecessor, the DAD322: the X-axis speed has been boosted from 500 mm/s to 800 mm/s, and the Z-axis speed from 30 mm/s to 80 mm/s. The system features a 15-inch display with a graphical user interface (GUI) and includes automatic calibration as a standard function. It also utilizes the same operating system common to the 3000 series, which helps minimize the learning curve for operators.
