The DISCO DAD3231 is a single-spindle automatic dicing saw designed for 6-inch (Φ6") workpieces. Within DISCO’s compact product lineup, it shares the same underlying control architecture as the DAD3221, yet follows a distinct design philosophy: while the DAD3221 prioritizes an ultra-small footprint, the DAD3231 utilizes extra internal space to offer enhanced customization capabilities. It is positioned by the manufacturer as an expandable platform well-suited for processing electronic component materials such as glass and ceramics.
Core Specifications and Precision
The standard processing capacity accommodates 6-inch (Φ6") circular workpieces, with options available for 150 mm × 150 mm square workpieces. Through custom configurations, the capacity can be further expanded to handle 8-inch (Φ8") workpieces or dimensions up to 210 mm × 210 mm. The X-axis offers a cutting range of 210 mm with a cutting speed of 0.1–800 mm/s. The Y-axis positioning accuracy is 0.005 mm/185 mm (with a single-point error of 0.003 mm/5 mm); this can be improved to 0.002 mm/185 mm (with a single-point error of 0.001 mm/5 mm) by opting for a Y-axis linear scale. The Z-axis features a repeatability of 0.001 mm and a motion resolution of 0.000002 mm.
Spindle and Efficiency
The machine comes standard with a 2.0 kW high-torque spindle (40,000 min⁻¹, rated torque 0.48 N·m), capable of handling challenging materials like glass and ceramics. An optional 1.8 kW high-speed spindle is also available, increasing the maximum rotational speed to 60,000 min⁻¹. Significant gains in efficiency are achieved through the implementation of servo-driven axes and high-speed communication, resulting in a reduction of cutting time by approximately 5% compared to previous-generation models. The optional new-generation NCS (Non-Contact Setting) system reduces blade height measurement time by 74% while enhancing measurement accuracy, directly cutting down on non-cutting auxiliary time.
Operation and Expandability
Automatic calibration, autofocus, and automatic kerf (cut-line) detection come as standard features. The XIS interface integrates operation controls directly into the microscope display, lowering the barrier to operation. The microscope’s ring illumination supports three-channel switching, improving the visibility and detection of kerfs. The system also supports the SECS/GEM communication standard, facilitating seamless integration into production lines. With dimensions of 650 × 950 × 1,670 mm and a weight of approximately 550 kg, the unit is noticeably larger than the ultra-compact DAD3221 (490 × 870 mm, 420 kg); this additional space is intentionally reserved for custom modifications and the accommodation of accessories. For applications requiring the processing of materials such as glass or ceramics on a 6-inch platform—especially where non-standard requirements for workpiece dimensions or precision exist—the DAD3231 offers greater flexibility for customization compared to more compact models.
