The NeonTech NDS-5200 is a fully automated, dual-spindle dicing saw designed for large-format workpieces up to 300 mm (12 inches). Positioned within NeonTech’s product lineup as a high-throughput model for mass production, it is engineered to strike an optimal balance between efficiency and stability when processing large-diameter wafers and a wide variety of other materials.
Core Architecture: Dual Spindles and Granite Platform
The NDS-5200 features two air-bearing spindles, each with an output power of 2.4 kW and a rotational speed range of 10,000–60,000 rpm, capable of handling the dicing requirements for materials such as silicon, ceramics, BGA, LEDs, and PCBs. NeonTech describes this as a "face-to-face dual-spindle" design, specifically configured to maximize production throughput. The machine utilizes a granite base combined with a bridge-style structure—a design choice focused on suppressing vibration and enhancing rigidity to provide a stable mechanical foundation for high-speed, dual-spindle operation.
Precision and Motion Specifications
The Y-axis (indexing axis) is equipped with a 0.1 μm linear encoder for feedback, offering a unidirectional pitch accuracy of 0.001 mm/5 mm, a positioning accuracy of 0.002 mm/300 mm, and a minimum step size of 0.1 μm. The X-axis (dicing axis) has a travel range of 500 mm, a dicing speed of 0.01–400 mm/s, and a minimum step size of 1 μm. The θ-axis (rotational axis) provides a rotation range of 380° with an angular resolution of 0.000176°.
Automation and Operation
The system supports a fully automated, cassette-to-cassette workflow. Loading, pre-alignment, optical alignment, dicing, spin-cleaning, and unloading are all performed by the machine, requiring no manual intervention. The operator interface features a 17-inch touchscreen and supports multiple languages, including Korean, English, Chinese, and Japanese. The worktable is optimized for large-format processing (up to 300 mm), allowing for a higher capacity of workpieces within a single-ring frame; this extends the intervals between loading/unloading cycles and reduces the frequency of manual intervention. The machine measures 1370 × 1800 × 1850 mm and weighs approximately 2500 kg. For applications involving 12-inch wafers, large-sized ceramics, or PCBs—where fully automated, continuous production is required—the NDS-5200 offers a robust, production-ready solution that balances the high throughput of a dual-spindle configuration with the superior stability of a granite platform.
