UENO SEIKI High-Flexibility die Sorter

UENO SEIKI Test Handler RS20The RS20 is the foundational model in UENO SEIKI’s wafer/die sorting platform lineup, officially categorized as a highly flexible wafer-sorting system. Its primary function is to perform visual inspections of individual dies—housed within a diced wafer frame—before placing them into carrier tape. Through various modular options, it can be configured for additional tasks such as electrical testing, laser marking, or multi-tape output.

Core Specifications

The RS20 supports 6, 8, and 12-inch wafer frames and accommodates die sizes ranging from 0.2 mm to 12 mm. It is compatible with a wide array of devices, including WLCSP, bare dies, QFN/DFN, MEMS, RF filters, and power semiconductors. In its standard sorting configuration, it achieves a throughput of 50,000 UPH (units per hour), with support for carrier tape widths of 8, 12, 16, and 24 mm.

Inspection Capabilities

The standard configuration includes six-sided visual inspection, covering defects such as edge chipping, micro-cracks, sidewall cracks, and bump irregularities. Optional inspection features include thickness measurement, in-pocket inspection, post-sealing inspection, 3D inspection, bump coplanarity checks, and AI-assisted inspection. Near-infrared (NIR/SWIR) inspection is also available as an option for internal examination of specific package structures.

Modular Expandability

The "flexibility" of the RS20 is reflected in its extensive range of options: modules for electrical testing, reject bins for failed dies, laser marking, dual-tape output, various feeders, and 2D code readers can be added as needed. The system handles die thicknesses from 30 μm to 1 mm, with an optional configuration that extends this range up to 2 mm.

In short, the RS20 is a wafer-sorting system that combines high-speed taping (up to 50,000 UPH) with a modular design, allowing it to adapt to a wide variety of operational requirements. It shares its underlying architecture with the RS20-Tray (wafer-to-tray, 10,000 UPH) and the RS20-DualSide (double-sided contact testing for power semiconductors, 10,500 UPH)—both built on the same platform—yet each serves a distinct market position.


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