Core Positioning
The RS24 is a model within Ueno Seiki’s highly flexible wafer-sorting platform that shares its underlying architecture with the RS20. On the official website, the two are presented under a single product entry, as they feature nearly identical core specifications and functional options. The system is designed to automatically load diced wafer frames, perform visual inspections, and output qualified dies into carrier tape. Through various modular options, it can be configured into a multifunctional system capable of electrical testing, laser marking, or multi-tape output.
Throughput and Compatibility
The system offers a base sorting throughput of 50,000 UPH and supports 6, 8, and 12-inch wafer frames. It accommodates carrier tape widths of 8, 12, 16, and 24 mm. It handles die sizes ranging from 0.2 mm to 12 mm and is compatible with a wide variety of package types, including WLCSP, panel-level packages, bare dies, QFN/DFN, MEMS, RF filters, and power semiconductors.
Inspection Capabilities
The standard configuration includes six-sided visual inspection, covering defects such as edge chipping, micro-cracks, sidewall cracks, and bump irregularities. Optional features include thickness measurement, in-pocket inspection, post-sealing inspection, infrared (NIR/SWIR) inspection, 3D height measurement, bump coplanarity inspection, color imaging, and AI-assisted inspection to reduce "overkill" (false rejects). The system handles die thicknesses from 30 μm to 1 mm, with an optional extension to 2 mm.
Modular Options
The flexibility of the RS24 is reflected in its modular add-ons: users can configure the system with electrical testing, reject bins for failed dies, laser marking, dual-tape output, various feeders, and 2D code readers. These options allow the machine to evolve from a dedicated visual inspection and sorting system into a comprehensive solution with integrated testing and traceability capabilities.
Relationship with the RS20
The RS24 and RS20 share a single product page on Ueno Seiki’s official website, with identical specifications. These two designations represent different configuration codes for the same platform, rather than distinct models with fundamentally different functional roles. If a production line requires a wafer-to-tape sorting capacity in the range of 50,000 UPH—while also maintaining the flexibility to add electrical testing or laser marking capabilities at a later stage—then the RS24 and RS20 are, from a technical standpoint, simply two labels for the same underlying solution.
