Core Positioning
The RV16-NEO is a model within Ueno Seiki’s "NEO" series of wafer/die sorting platforms, positioned alongside the RV36-NEO (both share the same product page). It is marketed as the "fastest wafer/die sorter," specifically optimized for chip sizes under 1 mm. It is designed to deliver maximum throughput and the lowest Total Cost of Ownership (TCO) within a compact footprint.
Throughput and Compatibility
With a base sorting throughput of up to 70,000 UPH, it ranks among the fastest machines in its category. It supports 6, 8, and 12-inch wafer frames for input, and accommodates 8 mm and 12 mm carrier tape widths for output. The system handles chip sizes ranging from 0.2 mm to 5 mm and is compatible with a wide variety of formats, including WLCSP, panel-level packages, bare die, LEDs, compound semiconductors, QFN/DFN, MEMS, and filters.
Inspection and Modularity
Standard inspection capabilities include six-sided visual inspection—covering issues such as chipping, micro-cracks, sidewall cracks, and bump defects. Optional features include thickness measurement, in-pocket inspection, post-sealing inspection, infrared (NIR/SWIR) inspection, 3D height measurement, bump coplanarity inspection, color imaging, and AI-assisted inspection to reduce "overkill" (false rejects). The system can process chips with thicknesses ranging from 30 μm to 1 mm. Modular options include electrical testing, reject bins, laser marking, tape feeders, and 2D code reading.
