The Mi20 is a comprehensive platform designed specifically for the Wafer-to-Reel process used in WLCSP (Wafer-Level Chip-Scale Packaging). Its primary function is to sort individual dies from a diced wafer and place them directly into carrier tape—effectively integrating the sorting and placement stages. In the secondary equipment market, it is sometimes classified as a "die sorter" and other times as a "die bonder"; this ambiguity arises because the system is capable of performing both sorting and placement operations.
Throughput and Processing Capabilities
The system offers a maximum throughput of 20,000 UPH (units per hour) and supports wafer frames up to 12 inches in diameter, with a minimum die size capability of 0.3 mm × 0.3 mm. This throughput level is significantly lower than that of the Ueno Seiki RV series (which reaches 70,000 UPH), positioning the Mi20 for applications that require the sorting and taping of tiny WLCSP dies, but where extreme production volume is not the primary priority.
Vision and Motion Control
According to technical specifications provided by secondary equipment dealers, the core hardware of the Mi20 is engineered for high-precision alignment and placement. It features high-resolution cameras and image processing algorithms that support multi-angle visual inspection and automated pattern recognition. The motion platform utilizes linear motor drives combined with multi-axis control (X-Y-Z translation, rotation, and tilt) to ensure the precise positioning and placement of miniature dies. The system also offers flexibility in assembly processes, supporting various bonding/placement methods such as epoxy, eutectic, thermocompression, and ultrasonic bonding.
