The SRM XD246 is a turret-style semiconductor test handler manufactured by Malaysia-based SRM Integration. It is designed for the final stage of semiconductor packaging, performing core tasks such as electrical testing, visual inspection, and sorting/taping. While it belongs to the same turret-based product family as the SRM XD244, its specific positioning depends on the individual unit's configuration.
Core Functions and Workflow
The XD246 follows a clear operational sequence: a high-speed turret transports chips from the input feed to the test station, where electrical testing is conducted via pin contact. Based on the test results, the system automatically sorts the chips into "pass" and "fail" categories, subsequently taping the qualified units onto carrier reels. Similar to the XD244—which utilizes tube-based input and carrier-tape output—the XD246’s turret architecture makes it particularly well-suited for handling components supplied in bulk or via vibratory bowl feeders.
Key Capabilities
The equipment integrates a six-sided Automated Optical Inspection (AOI) system, enabling the detection of surface defects both before and after electrical testing. Some sources—originating from third-party equipment aggregation websites—mention a 95% navigation (alignment/positioning) accuracy and the potential inclusion of AI-assisted inspection; however, as these claims are not corroborated by official SRM technical manuals, they should be treated with caution. The system is applied in the final testing of packaged semiconductors across sectors including automotive electronics (such as those for autonomous driving), consumer electronics, and telecommunications.
Positioning
The XD246 is a high-speed turret-style handler designed for post-packaging final testing, with its primary value proposition lying in the seamless integration of electrical testing and visual inspection.
