In a die bonder, these sensors serve as critical "sensory organs." Common applications include verifying the presence of a wafer or substrate, detecting the position of the bonding head or nozzle, and monitoring the smooth movement of materials. When the light path is obstructed, the sensor sends a switching signal to the equipment's main controller, triggering the next operational step. In a die bonder, these sensors serve as critical "sensory organs." Common applications include verifying the presence of a wafer or substrate, detecting the position of the bonding head or nozzle, and monitoring the smooth movement of materials. When the light path is obstructed, the sensor sends a switching signal to the equipment's main controller, triggering the next operational step.
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