Die Bonder Parts

ASM Die Bonder Link Line 12-E47635
2026-11-07
This item is an internal connecting cable (Link Line) for an ASM die bonder; part number 12-E47635.
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ASM Die Bonder Renishaw Grating Scale Readhead 02-58186
2026-11-07
This item is a Renishaw encoder readhead for an ASM die bonder; the ASM part number is 02-58186.
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BESI Die Bonder Motor 5006-5899
2026-11-07
This is a servo motor for a BESI (ESEC) die bonder; part number 5006-5899.
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BESI Die Bonder motor encoder cable 9056476
2026-11-07
This item is a motor encoder cable for a BESI (ESEC) die bonder, part number 9056476.
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ASM Die Bonder Light 02-E32048
2026-11-05
In conjunction with a machine vision system, this provides precise illumination of the chip outline and fiducial marks—both when the nozzle picks up a die from a wafer and when it places the die onto
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ASM Die Bonder Encoder 02-E25394
2026-11-05
This is an encoder component for an ASM die bonder, used for position feedback of the motion axes.
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ASM Die Bonder Board 02-15467 D LF 03-21127
2026-11-05
The core function of this module is to precisely control gas flow during the die-bonding process.
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Besi Wafer Ring Unit P/N:102269361
2026-10-22
The wafer ring device of the Besi die bonder is the core execution component of the wafer supply system
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Besi Z-DRIVE PPBAZ P/N: 5000-0210
2026-10-22
It is the core drive component within the bonding head of a Besi die bonder, responsible for precise vertical positioning and force control.
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