Core Function
The primary role of this module is to precisely control gas flow during the die-bonding process. By regulating the vapor mass flow within a "bubbler system," it ensures the stability of the soldering or bonding process, serving as a critical component for process gas control.
Key Features
Based on the component specifications, this module offers the following design features: it is resistant to fluctuations in liquid level, temperature, and pressure; it supports liquid-level monitoring; it is insensitive to mounting orientation; it offers various gas connection configurations; it operates at lower heating temperatures compared to direct evaporation methods; and it is equipped with a thermal control valve that automatically purges the gas line in the event of a power failure.
