Core Structure: Features a black metal housing with a rectangular light-emitting aperture (containing a high-brightness LED array paired with a diffuser), designed to provide uniform, high-contrast illumination during the chip pick-and-place process.
Mounting and Interfaces: Equipped with mounting holes on both sides, allowing it to be secured via screws near the bonding head or camera of the die bonder. A cable extending from the rear provides power and control signals to the light source.
Function in Die Bonders: Works in conjunction with a machine vision system to precisely illuminate the outlines of chips and fiducial marks—both when a nozzle picks up a die from a wafer and when it places the die onto a substrate (or lead frame)—thereby ensuring placement accuracy.
