The Pick & Place (P&P) Z-axis of a Besi die bonder is the core component responsible for placement accuracy. According to official documentation, this Z-axis features an enhanced design with an integrated encoder, utilizing closed-loop control to achieve high-precision placement. In the Esec 2100 sD advanced i model, this closed-loop P&P Z-axis works in tandem with a device height sensor and a high-precision bonding head to ensure consistent placement, even when handling thin dies or warped substrates. The motion trajectory of the Z-axis is managed by an advanced real-time trajectory controller, striking a balance between high speed and high precision.
The specific part in question is a Z-axis drive/motor assembly for a Besi die bonder. Based on its functional role, it serves as the drive unit or motor component within the aforementioned closed-loop Z-axis system; it receives commands from the controller and drives the bonding head to perform vertical pick-and-place operations.
