
The ACCRETECH TSK FP3000W is a high-precision prober designed for 300mm wafer-on-frame applications, specifically for testing CSP, WLP, and PLP devices mounted on frames following the dicing process. Its core advantage lies in a unique calibration technology that compensates for positioning errors caused by frame deformation, enabling measurements with micron-level precision. The system supports seamless, one-touch switching between wafer and frame testing, and offers optional features such as high-temperature testing environments, FFU (Fan Filter Unit) cleanroom modules, and probe-mark inspection—making it well-suited for back-end testing requirements in areas like advanced packaging and MEMS.