besi Esec 2100 SSI

The Esec 2100 SSI is a fully automatic die bonder from Besi, designed for high-power packaging and built upon the well-established Esec 2100 12-inch platform. Its core configuration features a Phi-Y pick-and-place system and a soft-solder indexing unit, supporting soft-soldering, diffusion bonding, and direct sintering processes. The system offers an optional 300N closed-loop high-force module, achieving a placement accuracy of 50 μm @ 3σ for soft-soldering and 35 μm @ 3σ for eutectic/diffusion bonding, with a dry cycle time of 265 ms. It accommodates die sizes ranging from 0.5 to 15 mm and lead frames up to 300 mm in length, making it well-suited for the mass production of high-power devices.