TEL P-8XLm

The TEL P-8XLm is an 8-inch (200mm) high-performance, fully automatic wafer prober introduced by Tokyo Electron (TEL) in 2004. Positioned as the flagship model within the P-8 series at the time, it was designed primarily for wafer testing of high-performance devices at next-generation technology nodes.

Its core advantage lies in its incorporation of the high-rigidity XYZ probing technology derived from the 300mm P-12XL series. It achieves an XY contact accuracy of ±2.0μm and a Z-axis accuracy of approximately ±5.0μm, complemented by an advanced optical system. The system supports wafers ranging from 4 to 8 inches and offers optional features such as a wide-temperature testing environment (from -55°C to 150°C) and a triaxial chuck for low-current measurements. It utilizes a multilingual SUI (System User Interface) and maintains software compatibility with the existing P-8 series, facilitating a seamless upgrade process for production lines. As an enhanced iteration of the P-8 series—which saw a cumulative shipment of over 7,300 units—the P-8XLm remains in circulation on the secondary market, serving as a practical choice for 200mm production lines that require a balance of high precision and proven, mature technology.