Besi Datacon 2200 APM

The Besi Datacon 2200 APM is a high-precision multi-module placement machine from Besi (formerly Datacon). It's a flexible platform targeting the advanced packaging market, primarily designed for multi-chip and flip-chip applications. Its official placement accuracy is ±10 µm @ 3σ, and throughput can be doubled through multi-module cascading.

Core Capabilities and Configuration

This equipment supports mixed multi-chip and multi-flip-chip placement, suitable for various packaging forms such as FCOB, MCM, PBGA, FCBGA, COB, and CSP. The platform adopts an open architecture, allowing up to four modules to be cascaded, improving up to 1000 kilobytes per second (UPP) through parallel processing, while still requiring only one operator. Key functions include an automatic wafer changer system, wafer mapping, automatic tool changer, and a multi-chip ejector rotation system.

Process Details

The equipment is equipped with a precision flipping mechanism that picks up chips from the wafer, flips them 180°, and mounts them to the substrate almost simultaneously. The adhesive application unit can apply flux or other media to the bumped chips, supporting chips up to 1 inch in size. The high precision is achieved through an automatic calibration system, high-resolution image processing, a theta-axis servo motor, and XYZ-axis linear motors.