ASM ISLinDA

The ASM ISLinDA is a 12-inch fully automated high-precision die bonder designed for advanced packaging and chip stacking processes. Its core advantages lie in handling ultra-thin chips and maintaining high cleanliness.

Core Positioning and Precision: This machine is specifically designed for advanced ICs, discrete devices, and CMOS image sensors (CIS). It achieves a placement accuracy of ±15 μm @ 3σ, and with DAF film processes, rotational accuracy can be controlled within ±0.1°. It employs a DDR direct-drive rotary bonding arm, allowing for parallel pick-and-place operations to increase throughput.

Ultra-Thin Chips and Cleanliness Control: Its hallmark capability is the stable handling of ultra-thin chips with a thickness of only 20 μm. It utilizes a patented two-stage ejector system and a pinless ejection solution to reduce the risk of chip breakage. The entire machine is equipped with a ULPA filter, achieving a filtration efficiency of 99.9995% for 0.12 μm particles, meeting the requirements of high-cleanliness environments such as CIS.

Material compatibility: Supports wafers up to 12 inches, with chip sizes ranging from 1.0×1.0 mm to 25.4×25.4 mm, and is compatible with various packaging forms such as leadframes, BGAs, PCBs, and ceramic substrates.