Used ASM VOTEX II XL

It is a high-performance LED die bonder designed for Mini LED direct-view and backlight applications, and can be seen as a larger substrate extension of the standard VORTEX II.

Core Positioning and Specifications

According to the equipment distributor's page, the VORTEX II XL emphasizes its ability to handle large substrates while maintaining high speed, supporting substrates up to 500mm × 600mm, suitable for panel-level or large-size display production. Its die bond cycle is 80ms (@1.5mm pitch), XY positioning accuracy is ±15μm @ 3σ, and chip rotation accuracy is ±1° @ 3σ.

Process Compatibility

A significant feature of this model is its flexibility: it is suitable for both Mini LED backlight applications and small-pitch RGB LED direct-view displays, handling RGB direct-view pitches as small as P0.4 and supporting chip gaps as small as 20μm. The chip size processing range covers 75μm × 125μm to 1016μm × 1016μm, and with optional features, it can process chips as small as 50μm × 100μm.