BESI Esec 2100 hS

The Besi Esec 2100 hS is a high-speed epoxy die bonder from the Esec product line—a brand under Besi—designed for high-throughput, high-precision mass production in semiconductor packaging.

Key performance specifications include a standard placement accuracy of 20 µm (3σ), which can be enhanced to 15 µm with an optional high-precision mode, and a maximum throughput of approximately 18,500 UPH. The pick-and-place system features a lightweight yet rigid design, integrating a combination of Phi-Y rotational and linear motion. When paired with an optional liquid-cooling system, it ensures consistent accuracy even at high operating speeds.