The DISCO DFD6361 is a fully automated dicing machine for Φ300 mm wafers, featuring a core opposing dual-spindle design. It controls total cutting time by reducing blade spacing and offers an optional non-contact height sensor (NCS) to significantly reduce downtime during focusing and inspection. The machine incorporates a Synchronous Spindle™ to enhance radial rigidity and ensure consistent cutting quality. A standard 1.2 kW spindle is available, with optional 1.8 kW or 2.2 kW high-rigidity spindles for handling high-load materials such as glass and ceramics. Furthermore, its gantry structure and optimized transport system allow for a compact footprint while maintaining a 300 mm processing capacity. The DISCO DFD6361 is a fully automated dicing machine for Φ300 mm wafers, featuring a core opposing dual-spindle design. It controls total cutting time by reducing blade spacing and offers an optional non-contact height sensor (NCS) to significantly reduce downtime during focusing and inspection. The machine incorporates a Synchronous Spindle™ to enhance radial rigidity and ensure consistent cutting quality. A standard 1.2 kW spindle is available, with optional 1.8 kW or 2.2 kW high-rigidity spindles for handling high-load materials such as glass and ceramics. Furthermore, its gantry structure and optimized transport system allow for a compact footprint while maintaining a 300 mm processing capacity.
Post time:
