The DISCO DFD6341 is a fully automated, opposing, dual-spindle dicing machine for Φ200 mm (8-inch) wafers, positioned as a mainstream model for 8-inch mass production.
Its core upgrade lies in incorporating the throughput-enhancing technology from the 300 mm model DFD6362, increasing the X-axis return speed to 1,000 mm/s. Combined with optimized acceleration and deceleration performance across all axes and a shorter spindle spacing, it significantly reduces processing time during dual-blade dicing. While reducing the footprint by approximately 3% compared to its predecessor, the DFD6340, the machine still integrates four types of components: transformer, UPS, CO₂ injector, and booster pump, requiring no additional space. Operationally, it retains the market-proven combination of a GUI and LCD touch panel, and offers an optional high-speed flash calibration function for rapid, uninterrupted table alignment.
In terms of specifications, the spindle power is available in 1.2 kW, 1.8 kW, or 2.2 kW, with a speed range of 6,000–60,000 min⁻¹ (up to 80,000 min⁻¹ for high-speed specifications). The Y-axis indexing step accuracy is 0.0001 mm, and the Z-axis repeatability is 0.001 mm.
