ASM CM-LinDA

The CM-LinDA is a fully automated die bonder from ASMPT, targeting the CMOS image sensor (CIS) and advanced packaging fields. Its core advantages lie in its high-density leadframe and panel-level die bond capabilities.

Core Process Capabilities: This machine is positioned as a multi-functional, high-precision platform, supporting panel die bond and high-density leadframe processing, and adapting flexibly to different packaging forms. In terms of accuracy, the XY positioning accuracy in standard mode is approximately ±10 μm, which can be further improved to ±7 μm when using die bond film (DAF) technology. Wafer rotation accuracy is controlled at the ±0.1° level.

Materials Compatibility and Specifications: The equipment supports processing wafers up to 12 inches in size, covering chip sizes from standard 1×1 mm to 25.4×25.4 mm, and substrate lengths from 150 to 300 mm. The machine dimensions (including the input tray) are 2440 × 1611 × 2418 mm, and it features factory automation connectivity.