Smt 3d Spi Used Automatic SMT Solder Paste Inspection Machine 3D SPI – Xinling

Model KY8080
Function High temperature resistance
Automatic grade Automation
Machine dimension 800*1335*1627mm
Board Size Single Lane 50×50 – 350×330mm
Dual Lane 50×50 – 350×580mm
Fov Size 36*36mm
Power 220V,10A
Weight Single lane:600kgs
Dual lane: 650kgs
All pressure 4-6 bar
Maximum loading PCB size X330*Y350mm
Certification CE. ISO. RoHS
Transport Package Standard wooden package
Measurements: volume,acreage,height, XY offset, shape
Detection of Non-Performing Types missing print,insufficient tin, excessive tin, bridging, offset, mal-shapes, surface contamination
Lens Resolution 4.5um/5um/6um/8um/10um/12um/15um/16um/18um/20um
Accuracy:XY (Resolution) 20um
Repeatability height:≤1um (3 Sigma);volume/acreage:<1%(3 Sigma)
Gage R&R <<10%
Inspection Speed 0.35sec/FOV-0.5sec/FOV
Mark-point Detection Time 0.3sec/piece
Maximun Meauring Head ±550um (±1200um as option)
Maximun Measuring Height of PCB Warp ±5um
Minimun Pad Spacing 100um
Minimum element 01005/03015/008004 01005/03015/008004
Maximun Loading PCB Size(X*Y) 450x500mm(B) 470x500mm (C) 630x686mm
Equipment repeatability accuracy <10% (5 Sigma)