The HANMI micro SAW T2101 is a dicing saw designed specifically for automotive-grade semiconductor packaging. Its core feature involves securing the semiconductor packages onto a dicing tape before the cutting process; this protects specialized chips—such as those that cannot be exposed to water, or those with large dimensions and significant thickness—during dicing.
Core Positioning and Applications
As the fourth model in the HANMI micro SAW series, the T2101 was launched and delivered to global customers in March 2022. Its "tape-based dicing" method is particularly well-suited for components that could be damaged by water (e.g., power packages and sensors) as well as large, thick automotive-grade packages, where the tape layer serves as a critical protective medium.
Key Performance Features
The system utilizes a dual-chuck design, which, according to HANMI, delivers a production efficiency increase of over 40% compared to competing models. Furthermore, it is a fully automated system—offering distinct advantages in precision and operational convenience over some of the semi-automated alternatives available on the market at the time of its release.
Summary
In short, the T2101 is a dicing saw tailored for automotive-grade semiconductors that uses dicing tape to support and protect the workpieces. Through its dual-chuck configuration and fully automated design, it ensures high yields when dicing specialized packages while simultaneously achieving superior production throughput.
