molding machine

YAMAHA GTM-X MS Manual Semiconductor Encapsulation Molding System

The YAMAHA GTM-X MS is a manual semiconductor encapsulation molding system.

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Used TOWA CPM1080-HP molding machine for sale

The TOWA CPM1080-HP is a high-precision model within the CPM1080 compression molding platform from the Japanese company TOWA.

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Used TOWA CPM1080

The TOWA CPM1080 is a compression molding system introduced by the Japanese company TOWA.

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Used Besi Fico AMS-LM Top Foil

The Besi Fico AMS-LM Top Foil is a fully automatic molding system designed for single-sided encapsulation of large-format substrates (such as BGA, QFN, and BOC).

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Used Besi AMS-X for sale

The Besi AMS-X is an automated lead-frame forming system designed for high-density and power semiconductor packaging.

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ASMPT IDEALmold™ R2R for sale

The ASMPT IDEALmold™ R2R is an automated reel-to-reel (R2R) semiconductor packaging molding system.

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Used ASMPT IDEALmold™ 3G

ASMPT IDEALmold™ 3G is an automated compression molding system designed for high-precision semiconductor packaging.

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Used ASAHI COSMO-T Series Transfer Molding Machine

The COSMO-T series from ASAHI (Asahi Engineering) is the company’s standard line of transfer molding equipment designed for semiconductor packaging.

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Used Asahi Engineering COSMO-RL60 molding machine

This unit belongs to the COSMO-RL series and features a 60-ton clamping force; it is a specialized reel-to-reel molding system designed for the semiconductor packaging sector

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