Teradyne UltraFLEXplus

Teradyne's UltraFLEXplus is a scalable automated test equipment (ATE) for high-end SoCs, positioned as a leading global semiconductor test platform designed specifically for AI accelerators, xPUs, data center networks, and ADAS chips.

Its core advantages lie in a significant leap in throughput and engineering efficiency: the new architecture reduces test unit requirements by 15% to 50% through increased workstations and parallel testing efficiency; and mass production deployment time is reduced by more than 20% thanks to IG-XL software compatibility and the Broadside interface. The platform offers two configurations: the Q series (Q24/Q12/Q6 multi-module) and the S series (compact single-module), catering to both high-volume production and high-mix, variable-batch scenarios.

In terms of power supply, the UltraVS64-HP single instrument can provide 1,280A of current, with a combined power supply of 5,120A, meeting the needs of high-power AI chips. With compatibility with the UltraFLEX ecosystem, the platform protects customers' existing testing investments while supporting full-scenario testing coverage from data center to edge AI.