mrsi-705

The MRSI-705 is a high-precision die bonder with a placement accuracy of ±5 micrometers, leading in installation volume in the advanced packaging field. It employs a granite platform and linear motor architecture, supporting multiple loading methods including wafer and waffle tray loading. Force control range is as low as 10 grams, making it suitable for handling fragile chips such as GaAs and InP. An optional turret-type tool changer module enables zero-downtime switching between up to 12 tools, significantly improving the throughput of complex multi-chip components.