asm ad838

The ASM AD838 is an automated high-speed epoxy die bonder designed for efficient die bonding of high-density leadframes such as QFN, TQFP, PLCC, and TSSOP. It supports substrate widths up to approximately 4 inches (101.6 mm) and features a high-precision linear motor system, patented bonding head, dual dispensing system, and advanced inspection capabilities, making it suitable for die bonding processes of ICs and discrete devices.