The HANMI micro SAW T1121 is a dicing system designed for cutting semiconductor packages. More specifically, it is tailored for "tape-based" dicing applications—a process particularly well-suited for packages that must be kept away from water.
Product Positioning and Series Context
The T1121 is part of HANMI Semiconductor’s "micro SAW" product line and belongs to the "T" series, alongside the T2101. HANMI first introduced the T2101—a "tape micro SAW" system designed for automotive semiconductors—in March 2022; the T1121 is another model within this same series, appearing alongside the T2101 in the exhibitor list for the SEMI trade show.
Core Functionality
Based on official descriptions of the T2101, the primary function of the T series is to dice semiconductor packages while they are mounted on adhesive tape. This process is especially advantageous for two types of products: power devices and sensors that cannot come into contact with water (as the tape provides a protective barrier during the dicing process, which typically involves water-based cleaning), and larger, thicker semiconductor packages used in automotive applications.
