The DISCO DFD6362 is a fully automatic precision dicing saw designed for Φ300 mm wafers. It features an opposed dual-spindle configuration, with a core design focus on enhancing mass-production efficiency and cleaning quality.
Key Performance Enhancements
Compared to its predecessor, the DFD6362 offers an approximately 7% increase in production efficiency under identical operating conditions. This improvement stems from three primary factors: a reduced distance between the dual spindles to accelerate dual-blade dicing, an enhanced X-axis mechanism for faster return speeds, and optimized transport components for high-speed material handling. The maximum X-axis cutting speed reaches 1,000 mm/s, while the Y-axis positioning accuracy is within 0.002 mm over a 310 mm range.
Critical Features and Configurations
Enhanced Cleaning: The blade-housing cover has been redesigned based on fluid-flow analysis to prevent particle adhesion. Optional features—such as a Chuck Table Water Curtain (CTWC) or a two-fluid nozzle at the cutting zone—are available to accommodate the specific characteristics of different workpieces.
Automatic Blade Changer (Optional): The ABC function automatically handles blade replacement, pre-cutting, and system restarts when a blade reaches the end of its service life or sustains damage. The dual-spindle blade change process takes approximately 60 seconds, and the system uses barcode scanning to ensure the correct blade is installed.
User Interface: The upgraded graphical software displays operation controls alongside microscope imagery on a single screen. Equipment status is presented via charts, facilitating both operator training and real-time monitoring.
Applications
This model is primarily used for the precision dicing and grooving of semiconductor wafers, glass, ceramics, SiC, sapphire, and other materials. If you are considering the purchase of pre-owned equipment, please note that some third-party listings may incorrectly label it as "laser equipment." In reality, the DFD6362 is a mechanical dicing saw; therefore, you should always refer to official DISCO specifications when evaluating the unit.
