ASM AD50 PLUS

The ASM AD50 PLUS is a high-speed, high-precision, fully automated die bonder, belonging to ASM (ASMPT) and used for chip mounting in the semiconductor packaging process. It is often categorized as an LED die bonder (dual-head).

Key Features and Specifications: This model emphasizes both high speed and high precision, equipped with a dual-head system to increase throughput. The die bond cycle is approximately 50ms, XY position accuracy is approximately ±1.5mil, and wafer rotation accuracy is ±5°. In terms of material compatibility, it can handle wafers ranging from approximately 3mil to 50mil.

Automation and Operation: The equipment features fully automated material handling capabilities, with optional stacked feeding and automatic wafer loading/unloading systems. It also incorporates a multi-functional image recognition system for precise alignment. The operating system is based on a Windows graphical interface, and the machine dimensions are approximately 1570×1160×2075 mm³.