ASM Linda Series

The LINDA series from ASM (commonly referred to as ISLinDA or CM-LinDA) is a high-precision, fully automated die bonder designed for advanced packaging, with a focus on ultra-thin die and stacked-die processes. Its core strength lies in its exceptional thin-die handling capability, enabling the stable placement of ultra-thin dies as thin as 20 microns, while supporting various stacking configurations such as pyramid and stepped (staircase) arrangements. The system features a dual-bonding-head design and a patented two-stage ejector system, which enhance throughput without compromising precision—achieving an XY placement accuracy of ±15 microns (@3σ). This platform is widely used in the packaging of advanced ICs, CMOS image sensors, and memory devices, making it particularly well-suited for applications that demand extreme thinness and high reliability in die stacking.