ASM AD8912

The ASM AD8912 is a fully automatic epoxy die bonder designed for the high-precision placement of semiconductor dies onto substrates during the packaging process. The system supports wafers up to 300mm (12 inches) in diameter, offers a placement accuracy of approximately 8.38 microns (in the X and Y axes), and can accommodate die sizes ranging from 10×10 mil to 1000×1000 mil.

It is equipped with dual pick-and-place heads (driven by linear motors), a vision system, an epoxy dispensing system (featuring a MUSASHI pump), and wafer mapping capabilities. It supports both pre- and post-bonding inspection, making it well-suited for high-volume automated production. Variant models, such as the AD8912 SD, offer enhanced compatibility with a broader range of bonding processes, including eutectic, epoxy, and conductive adhesive bonding.