ASM AD860

The ASM AD860 is a fully automated die bonder primarily used for high-precision mounting of LED packaging and semiconductor chips, typically using silver paste as the fixing material.

Core Performance: This model is positioned as a high-speed die bonder for small to medium-sized chips. Its XY mounting accuracy is approximately ±1.5 mil (±38.1 μm), wafer rotation accuracy is ±3°, and the single-chip bonding cycle is approximately 200 ms. In terms of material compatibility, it can handle chips ranging from 6 mil to 50 mil, supports substrate sizes up to 8" × 5", and has a wafer ring outer diameter compatible with 6-inch wafers.

System Configuration: The equipment features a monochrome or 256-level grayscale image recognition system with a viewing range of 0.2" × 0.2" for chip alignment. The die bonder head uses a surface-pickup design, and the die bonder pressure is adjustable from 30 to 250 g. The stage is a dual-station configuration with a travel range of 8" × 5".