ASM AD8312 Plus

The ASM AD8312 Plus is ASMPT's next-generation 12-inch fully automated silver paste die bonder, emphasizing high throughput and high precision, suitable for integrated circuit and discrete device packaging.

Core Positioning and Capacity: This model is positioned as a high-speed mass production machine. In standard mode, the XY position accuracy is ±20 μm (@3σ), which can be improved to ±12.5 μm in precision mode. Its maximum throughput is 17,000 wafers per hour, supporting wafers up to 12 inches (300 mm) in size and high-density lead frames of 300 × 100 mm.

Intelligent Modules: The AD8312 Plus integrates multiple i-series process control modules: iDispense for epoxy resin tail control, iSense for precision height measurement, iTouch for optimized die bonding motion for thin wafers and special epoxy resins, iBalance for vibration protection, iFlash for high-speed visual inspection, and iFlat for substrate warpage management. The equipment is also equipped with an upward-looking optical system to improve alignment accuracy and features a universal workpiece stage design to accommodate various packaging forms.

The machine dimensions are 2,510 × 1,620 × 2,062 mm³.