besi Esec 2009 SSIE

This is a fully automated soft solder die bonder specifically designed for power device packaging.

Core Positioning and Process

It employs soft solder technology for chip mounting, primarily serving the power device manufacturing industries in communications, automotive, and home appliances. It can handle various package types including SOT, SOD, SO, DPAK, TO, PQFN, Power LED, and power modules. Its core advantage lies in its patented soft solder process technology, reportedly the only soft solder die bonder on the market with an optional 300mm/12-inch wafer handling capacity.

Key Specifications

Typical capacity is 2,500 to 8,000 UPH, with a standard placement accuracy of 60µm @ 3σ, which can reach 50µm @ 3σ with optional optical bonding alignment (OBC). Chip size handling range covers 1×1 mm to 11×11 mm (or 0.4×0.4 mm to 13×13 mm), supporting wafers up to 8 inches, with 12-inch wafers as an option. Machine dimensions: 1,970 × 1,305 × 1,760 mm.

Technical Features: This machine employs point-to-line pick-and-place technology, balancing speed and accuracy. The dispensing system supports programmable pattern sizes and BLT (tool-free dispensing), achieving full solder pattern coverage and excellent wetting. Furthermore, the equipment supports quick changeover (with replaceable indexers), low gas consumption, and can be optionally equipped with a programmable ultrasonic module (PUM) to improve solder wetting and void control.