This is a fully automatic precision dicing saw equipped with dual chuck tables, specifically designed for high-throughput applications such as semiconductor package singulation.
Core Design: Dual-Chuck Parallel Operation
The standout feature of the DFD6750 is its dual-chuck table configuration. While one table is actively dicing, the other can simultaneously handle workpiece loading, alignment, and cleaning. This parallel processing significantly reduces spindle idle time, thereby substantially increasing overall throughput.
Key Specifications
Processing Capacity: Maximum workpiece size of approximately 300 × 160 mm (dicing area: 280 × 140 mm); X-axis travel: 300 mm; dicing speed: 0.1–1,000 mm/s.
Precision: Y-axis positioning accuracy is nominally 0.003 mm/660 mm (with a single-point error of 0.002 mm/5 mm); Z-axis repeatability is 0.001 mm.
Spindle Options: 1.8 kW (6,000–60,000 rpm, compatible with 2-inch blades) or 2.2 kW (3,000–30,000 rpm, compatible with 3-inch blades).
Process Enhancements
Compared to its predecessor, the DFD6750 features an improved vacuum chuck mechanism to minimize workpiece warpage. For debris management, it replaces traditional flexible conduits with stainless steel covers—reducing the risk of damage—and includes a brush-cleaning unit to facilitate the removal of residual material.
