This is a fully automatic, dual-spindle dicing saw designed for Φ200 mm (8-inch) wafers. As the successor to the DFD6341, it was released in 2023 and is primarily targeted at high-quality processing applications, such as those for automotive semiconductors.
Key Efficiency Improvements
The core enhancements of the DFD6342 focus on throughput and automation. The distance between the opposing spindles has been reduced to 19.8 mm, allowing for more simultaneous cuts. Combined with three-axis synchronous control—which shortens return times—and a new Non-Contact Set (NCS) system for blade alignment, the machine achieves a 6.4% increase in UPH (units per hour) under specific conditions. An optional Automatic Blade Changer (ABC) replaces blades automatically when they reach the end of their service life; this minimizes downtime and the risk of human error during installation, while also logging blade IDs to improve traceability.
Energy Efficiency and Usability
Compared to its predecessor, the DFD6342 utilizes high-efficiency spindle motors that generate less heat, resulting in a 63% reduction in spindle cooling water consumption and a 20% decrease in air usage. The operator interface has been upgraded from a 15-inch to a 19-inch touchscreen, featuring larger buttons and graphical displays for log data, enabling operators to intuitively assess error frequency and changes in blade status.
Key Specifications
The X and Y axes both offer a cutting range of 210 mm, with an X-axis feed rate of 0.1–1,000 mm/s. The Y-axis positioning accuracy is 0.002 mm/210 mm (with a single-point error of 0.002 mm/5 mm). Spindle options include a 1.8 kW version (6,000–60,000 rpm), a high-speed version (20,000–80,000 rpm), and a 2.2 kW version (compatible with 3-inch blades; 3,000–30,000 rpm). The device dimensions are 1,180 × 1,080 × 1,800 mm, with a weight of approximately 1,240 kg.
