The DISCO DFL7341 is not a traditional mechanical dicing saw, but rather a fully automated laser dicing system that utilizes "Stealth Dicing™" as its core process.
Core Positioning
Designed primarily for 8-inch (Φ200 mm) wafers, the system has an extensive track record in applications such as sapphire LED substrates and silicon-based MEMS (micro-electromechanical systems) microphones. Its defining feature is the use of a laser to create a modified layer within the wafer, which is subsequently separated via film expansion. As a completely dry process, it is particularly well-suited for MEMS devices that are sensitive to water-related damage.
Key Capabilities
Material Versatility: By utilizing various laser oscillators, the system can process materials such as sapphire, SiC, and GaAs with high quality. It enables the dicing of brittle materials—including SiC and GaN—without edge chipping.
Precision and Motion: The X-axis offers a processing range of 210 mm with a nominal positioning accuracy of 0.003 mm/210 mm, while the Z-axis provides a repeatability of 0.001 mm.
Specialized Functions: The system includes a height-adjustment feature to accommodate wafers with significant warpage, and it employs high-resolution sensors to identify wafer geometry.
