This is a fully automatic, dual-spindle precision dicing saw designed for Φ300 mm wafers. Its core objectives are to conserve cleanroom space and enhance processing efficiency through parallel dual-spindle operation.
Core Positioning: Compact Dual-Spindle Design
The DFD6560 features an opposing dual-spindle architecture with an optimized gantry-style layout. Compared to its predecessor, the machine’s footprint is reduced by approximately 16%, and the total installation area—including maintenance access—is decreased by about 20%, making it well-suited for deployment in automated production lines with multiple units arranged side-by-side. Most maintenance tasks can be performed from the front, eliminating the need for additional service space on the sides.
Key Specifications
Processing Capability: Supports Φ300 mm wafers; X-axis dicing stroke of 310 mm; dicing speed ranging from 0.1 to 1,000 mm/s.
Spindle Configuration: Equipped with a standard 1.8 kW spindle (6,000–60,000 rpm), with an optional high-speed version capable of reaching 80,000 rpm.
Precision: Y-axis positioning accuracy ≤0.002 mm/310 mm; Z-axis repeatability of 0.001 mm; Z-axis movement resolution of 0.00005 mm.
Process and Efficiency
The dual-spindle configuration allows for simultaneous dicing operations. The short-spindle design and slim blade-cover profile facilitate more parallel dicing paths, potentially increasing throughput by up to 10% in step-dicing applications. The system integrates the entire process—including automatic loading, image alignment, dicing, and cleaning/drying—and offers optional features such as two-fluid nozzles and a water-curtain system for the worktable to minimize particle residue.
